CEBIT 2009 news

The USB Implementers Forum (USB-IF) today announced the availability of the SuperSpeed USB Platform Interoperability Lab (PIL), providing USB 3.0 developers the opportunity to test host and device interoperability and ensure that devices perform correct USB 3.0 electrical signaling and link level transactions. Additionally, the lab will test conformance to the Framework defined in the USB 3.0 specification. The PIL will provide USB technology expertise to early host/device manufacturers as well as platforms with early implementations of host and device components for performing interoperability testing.

The SuperSpeed USB PIL will provide opportunities for parties interested in testing and developing SuperSpeed USB solutions. A prototype SuperSpeed USB software stack and test tools running on Windows will be made available to those testing at the SuperSpeed USB PIL.

Silicon vendors, IP vendors, device and host vendors, as well as companies developing SuperSpeed USB PHYs, can all benefit from visiting the PIL. Vendors can register their products for testing by visiting the SuperSpeed USB PIL Web site.

Test tools at the lab will evolve based upon feedback and learnings gained from attending developers, and will be made available to early adopters. Developers will continue to have access to the tools throughout their development process. Tests developed at the SuperSpeed USB PIL will become components of the SuperSpeed USB certification program.

To visit the SuperSpeed USB Platform Integration Lab, return the completed SuperSpeed USB PIL Visit Request Form to admin@usb.org.